Failure Analysis

Inverted Emission Microscope

The iPHEMOS optical tool is an inverted semiconductor failure analysis system developed especially for working through the backside silicon of semiconductor devices.

Pico-second Time-resolved Emission Microscope

The minute light emitted during the operation of CMOS transistors is picked up, and analysis of logic operations is carried out in two dimensions with picosecond precision.

Emission Microscope

Failure positions in semiconductor devices are found by detecting the light emitted by hot electrons, leaks, latchups and the like.

Thermal Emission Microscope

The heat generated by metal interconnection shorts, problems with contact hole resistance, oxide film microplasma leaks.

IR-OBIRCH Analysis

This device locates leak current paths and resistance abnormalities (via defects) in contacts using the "IR-OBIRCH" method where LSIs.


Failure Analysis Support

Failure Analysis Support System: FA-Navigation

FA-Navigation is a Windows based failure analysis support software.Localizing the actual physical failure site indicated by multiple photoemission sites with high spatial resolution typically requires a great deal of time and effort. FA-Navigation uses CAD data to effectively narrow down failure locations, and as it operates on a Windows platform and can run on a personal computer, the turnaround time (TAT) for failure analysis is reduced.


Thickness Measurement

Non-contact, high precision measurements are made for thickness of glass and film, wafer using an optical system.